Ball Grid Array (BGAs) are a widely used technology in a vast range of products including consumer, telecommunications and office based systems. An area array device provides high packing density with a relatively easy introduction cycle, often after a few years of experience. Over the last couple of years engineers have started to experiment and in some cases implement STACK packages, often called Package on Package (POP). In simple terms POP represents the stacking of components on top of each other either during the original component manufacture or during printed board assembly. POP packaging may include traditional reflow soldering, wire bonding, flip chip or conductive adhesives for device to device or die to die interconnection. There is a considerable number of variations in the package construction but in the case of POP packages during PCB assembly it's fairly simple in concept.
展开▼
