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首页> 外文期刊>Electronics Letters >Characteristics of GaAs MISFET devices using low-temperature-grown Al/sub 0.3/Ga/sub 0.7/As as gate insulator
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Characteristics of GaAs MISFET devices using low-temperature-grown Al/sub 0.3/Ga/sub 0.7/As as gate insulator

机译:以低温生长的Al / sub 0.3 / Ga / sub 0.7 / As作为栅绝缘体的GaAs MISFET器件的特性

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摘要

Al/sub 0.3/Ga/sub 0.7/As epilayers grown at low-temperature (LT) by molecular beam epitaxy (MBE) were used as insulators in the fabrication of MISFET devices. An LT-Al/sub 0.3/Ga/sub 0.7/As MISFET, having a gate length of 2 /spl mu/m, exhibited a transconductance of 161 mS/mm, an I/sub DSS/ of 320 mA/mm and a maximum drain voltage of 44.7 V, resulting in an I-V product of 1.65 W/mm; it displayed improved frequency dispersion characteristics over that of an LT GaAs MISFET.
机译:通过分子束外延(MBE)在低温(LT)下生长的Al / sub 0.3 / Ga / sub 0.7 / As外延层被用作制造MISFET器件的绝缘体。栅极长度为2 / spl mu / m的LT-Al / sub 0.3 / Ga / sub 0.7 / As MISFET的跨导为161 mS / mm,I / sub DSS /为320 mA / mm,最大漏极电压为44.7 V,导致IV乘积为1.65 W / mm;它显示出比LT GaAs MISFET更好的频率色散特性。

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