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InP-HBTs with good high frequency performance at low collector currents using silicon nitride planarisation

机译:使用氮化硅平坦化技术在低集电极电流下具有良好的高频性能的InP-HBT

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摘要

A fabrication process for small area HBTs with a self-aligned base contact has been developed, based on silicon nitride planarisation. The mean current gain for 130 realised devices ranged from 40 for the smallest devices, to 71 for the largest, with a standard deviation of >10%. The transit frequency was 94.7/spl plusmn/2.6 GHz, and the maximum frequency of oscillation 95.1/spl plusmn/4.4 GHz, at a collector current of only 0.3 mA. The extremely good high frequency performance at low currents and high uniformity improves the competitiveness using InP-based HBTs for fabrication of complex integrated circuits.
机译:基于氮化硅平面化,已经开发了具有自对准基极接触的小面积HBT的制造工艺。 130个已实现器件的平均电流增益范围从最小的器件的40%到最大的器件的71%,标准偏差> 10%。在仅0.3 mA的集电极电流下,过渡频率为94.7 / spl plusmn / 2.6 GHz,最大振荡频率为95.1 / spl plusmn / 4.4 GHz。使用基于InP的HBT制造复杂集成电路时,在低电流和高均匀性下的极佳高频性能提高了竞争力。

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