Starting from experimental data, an analytical approximation is proposed for the thermal wake function. An integral equation is found relating the temperature with the power distribution. Using a mathematical property of the beta function, the integral equation can be solved analytically, yielding the optimum power density.rnThe increasing power consumption of electronic circuits has initiated much research in the field of thermal analysis. One possible approach to reduce the maximum temperature in a circuit is the efficient placement of components on a board. Although the total power remains unaltered, the thermal conductivity of the substrate influences the temperature distribution. A different placement of the components on the substrate can give rise to lower peak temperatures. Several criteria can be put forward to find an optimal placement. Some authors optimised the reliability of the circuit [1].
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