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Transfer Methods of PZT Thin Capacitor to Flexible Polymer by Self-Assembled Monolayers

机译:自组装单分子膜将PZT薄电容器转移至柔性聚合物的方法

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This paper describes the fabrication method that a lead zirconate titanate (PZT) thin film capacitor, which is formed on a Si substrate by metal organic decomposition (MOD), can be easily transferred to flexible polymer (polydimenthylsiloxane; PDMS) without additional chemical contamination. The thin film capacitor is composed of sandwich structure of PZT between two metal layers. To embed the capacitor structure in the polymer substrate by dry peel-off process, three kinds of self-assembled mono-layers (SAMs) were investigated for adhesion or antiadhe-sion layer between metal, polymer, and Si substrate, respectively. Also, the MOD's annealing process with SAMs for PZT lamination was investigated. As a result, the PZT capacitors of 1 μm thickness with a perovskite structure were successfully transferred and embedded in PDMS substrate. These results will be useful for fabricating MEMS devices and integration technology of electrical device to a polymer substrate such as capacitors in three-dimensional integration or for flexible electronics.
机译:本文介绍了一种制造方法,该方法可将通过金属有机分解(MOD)在Si基板上形成的锆钛酸铅(PZT)薄膜电容器轻松转移到柔性聚合物(聚二甲基硅氧烷; PDMS)上,而不会产生额外的化学污染。薄膜电容器由两层金属之间的PZT夹心结构组成。为了通过干式剥离工艺将电容器结构嵌入聚合物基板中,研究了三种自组装单层(SAMs)分别用于金属,聚合物和Si基板之间的粘附层或防粘层。此外,还研究了采用SAM进行MOD退火的PZT层压工艺。结果,成功地转移了具有钙钛矿结构的厚度为1μm的PZT电容器,并将其嵌入PDMS基板中。这些结果对于制造MEMS器件和将电子器件集成到聚合物基板(如电容器)的集成技术(在三维集成中)或柔性电子学将很有用。

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