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Micromachining Using Soft X-Rays from Laser-Produced Xe Plasma

机译:使用激光产生的Xe等离子体中的软X射线进行微加工

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Micromachining of poly(tetrafluoroethylene) (Teflon) and poly(methyl methacrylate) (PMMA) samples was carried out using soft X-rays from a laser-produced Xe plasma source, which we developed. In the Teflon sample, the contact angle with a water droplet on a modified surface increased from 90° to 110° as a result of irradiation without a mirror or mask, while the angle decreased to 50° when using irradiation with them. Scanning electron microscopy showed numerous micro-protuberances and a masked pattern with micro-concavities on each sample surface. These results suggested that a change to the contact angle was caused by the microstructures on the Teflon surface. We succeeded in controlling the wettability of the Teflon surface, from hydrophobic to hydrophilic, by micromachining using laser plasma X-rays. In the PMMA sample, the etching rate was investigated with irradiation using a large number of pulses (192,000 pulses) and a low power density of 8 × 10~4 W/cm~2. The etching rate was calculated to be 5 pm/pulse. This was judged to be due only to photo-etching without any thermal effects. We demonstrated a pure photo-etching depth of about 1 μm.
机译:聚(四氟乙烯)(Teflon)和聚(甲基丙烯酸甲酯)(PMMA)样品的微加工使用来自我们开发的激光产生的Xe等离子体源的软X射线进行。在特氟隆样品中,由于没有镜面或掩模的照射,与改性表面上的水滴的接触角从90°增大到110°,而当使用它们进行照射时,该角度减小到50°。扫描电子显微镜显示出大量的微突起和在每个样品表面上具有微凹面的掩盖图案。这些结果表明,接触角的变化是由聚四氟乙烯表面上的微观结构引起的。通过使用激光等离子X射线进行微加工,我们成功地控制了聚四氟乙烯表面从疏水性到亲水性的润湿性。在PMMA样品中,使用大量脉冲(192,000个脉冲)和8×10〜4 W / cm〜2的低功率密度通过辐照来研究蚀刻速率。蚀刻速率经计算为5 pm /脉冲。认为这仅是由于光蚀刻而没有任何热效应。我们展示了大约1μm的纯光蚀刻深度。

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