Liquid cooling targets advanced microelectronics

摘要

The microelectronics-packaging industry is undergoing major changes to keep pace with the relentless demands imposed by high-performing chips and end-use system applica-tions. Solutions using ad-vanced materials for micro-processor-interconnect scaling and chip-package in-terconnects, novel concepts in heat-management sys-terns, and improvements in package substrates continue to drive major packaging ef-forts.