When MEMS/CMOS integration makes sense

摘要

In the past few issues of Project MEMS, we've discussed the move away from using monolithic silicon solutions to creating MEMS-based sensor and transducer systems. The use of muti-IC designs has made it possible to create devices quickly and less expensively than trying to force both MEMS and digital devices onto a single wafer of silicon.rnBut does that mean that monolithic device solutions are dead? According to a recent article by Karen Lightman, Managing Director of the MEMS industry Group, there are particular times when monolithic integration may be the best solution. For example, Stafford Johnson, engineering manager at MEMS-CAP, told Karen that when length and resistance of wiring impacts system performance, a fully integrated custom CMOS/ MEMS solution may be a viable option. "While off-the-shelf components reduce costs and speed time to market," he states, "there are still instances in which custom solutions may be required."