Connecting for speed and density

摘要

It's no secret that both the operating frequency and density of electronic components in systems is constantly increasing. These increases place a demand on interconnect companies to come up with smaller products that none-the-less can carry highspeed signals without letting them interfere with other waveforms. At the recent DesignCon meeting in Santa Clara, CA, a solid example of the interconnect industry's response to these demands was seen in the 28-Gb/s-plus Z-Ray micro array interposers from Samtec.