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首页> 外文期刊>IEEE Transactions on Advanced Packaging >A Better Technique Using Multisegment Modeling and Analysis of High-Density and High-Speed Connectors
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A Better Technique Using Multisegment Modeling and Analysis of High-Density and High-Speed Connectors

机译:使用多段建模和高密度高速连接器分析的更好技术

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摘要

A useful and rather new simulation technique for connectors up to 6.25 GHz is presented and discussed in this paper. The proposed model extracts electrical parameters of a connector using time-domain reflectometry (TDR) measurements. A new technique was developed to obtain accurate impedance profiles using TDR and a multisegment approach that is effectively a distributed coupled model. The parameter extraction and characterization of connectors are discussed. The performance of the proposed segmented transmission line model is verified by simulation of the model in SPICE and by experimental measurement. The results show that the proposed model can simulate the electrical characteristics, including crosstalk and impedance, of high-density and high-speed connectors with satisfactory accuracy. Based on the proposed modeling and CAD simulators, the design and analysis of complicated high-density and high-speed connectors can be executed accurately and effectively. Compared with other previous models, the proposed model can significantly improve the accuracy of simulation.
机译:本文提出并讨论了一种适用于高达6.25 GHz的连接器的有用且相当新颖的仿真技术。提出的模型使用时域反射法(TDR)测量来提取连接器的电参数。开发了一种新技术,可使用TDR和有效地为分布式耦合模型的多段方法获得准确的阻抗曲线。讨论了连接器的参数提取和表征。通过在SPICE中对该模型进行仿真并通过实验测量,验证了所提出的分段传输线模型的性能。结果表明,该模型可以模拟高密度和高速连接器的电气特性,包括串扰和阻抗。基于所提出的建模和CAD仿真器,可以准确,有效地执行复杂的高密度和高速连接器的设计和分析。与其他先前模型相比,该模型可以显着提高仿真的准确性。

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