TOOL SUITES BLEND TO INTEGRATE DESIGN

摘要

The ARM966E-S sub-system forms the lowest level of the hierarchical design (see figure 1). The 4Mgate, 5Mbit design was completed in 11 months. Agere's 0.1Bum BLM [layers of metal) 1.5V/3.3V process was used, wire-bonded into a 456 PBGAM package.