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Bare Die Market Gets Green Light

机译:裸机市场获得绿灯

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摘要

It's been repeated time and again — the push for "smaller, faster, lighter, and less expensive" is heralding the new age of technology, especially in electronic packaging. But the challenge remains — how do we get there from here? There isn't a single answer. The choices are so vast that today's designers and assemblers must analyze all factors when deciding to incorporate a single element. Managers then must assess the technical information and translate it into the overall bottom line.
机译:这是一次又一次的重复-“更小,更快,更轻,更便宜”的推动预示着技术的新时代,尤其是在电子包装领域。但是挑战仍然存在-我们如何从这里到达那里?没有一个答案。选择是如此之多,以至于当今的设计人员和组装人员在决定合并单个元素时必须分析所有因素。然后,管理人员必须评估技术信息并将其转化为总体底线。

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