Putting the chill on Hot Components

摘要

The Semiconductor Industry Association (SIA) road-map indicates by the year 2001 isolated lines and gates for microprocessors will be in the 0.12 micron range and have operating logic voltages between 1.2-1.5 V. When these projected numbers are overlaid on the expected device operational frequency of over 1 GHz, the result is a very high power density electronic device. If the SIA roadmap is forward-translated and projected onto a typical high-end microprocessor device, one could expect a total device power of 125W with a device heat flux of approximately 20-24 W/cm~2 around the year 2000.