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CSP Conversion Improves Cost, Quality, Reliability

机译:CSP转换可提高成本,质量和可靠性

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摘要

Replacing a chip on board (COB) component with a chip-scale-packaged (CSP) component resulted in measurable improvements in quality and reliability of a pencil-size bar code reader. Manufactured by the Hand Held Products Div., Welch Allyn, Inc., the electronics are built on a FR4 substrate that holds two integrated circuits, and several passive components. One of the ICs is small enough in its surface mount package to fit into the available pencil-shaped envelope, as are the passive components.
机译:用芯片级封装(CSP)组件替换板上芯片(COB)组件可导致铅笔大小的条形码阅读器的质量和可靠性得到可衡量的提高。电子产品由Welch Allyn公司的Hand Held Products Div。制造,在FR4基板上构建,该基板容纳两个集成电路和几个无源元件。其中一种IC的表面贴装封装足够小,无源元件也可以装入可用的铅笔形外壳中。

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