Acoustic Micro Imaging Rescues Process Control

摘要

Cracks are a frequent cause for the failure of ceramic chip capacitors, and often the root cause of a crack can be found in the capacitor manufacturing process. But one company found cracks were occurring after reflow on its very small boards. The impact on throughput was devastating; of the boards in production, as many as 40 percent were being sent to rework because of capacitor failures. A few of the cracks could be seen optically, but most of the boards simply registered electrical failures without any surface crack being visible.