The Principles of Better Stencils

摘要

Not all stencils are created equal. A key production concern in today's electron- ics assembly has become the reliable deposition of solder paste through sten- cils for better yields and reliability. Cor- rect/aperture formation and stencil design are critical to achieving these quality prints. Differences in aperture size and foil thickness will determine the volume and placement of solder paste applied to boards.