ADVANCED PACKAGING DELIVERS CAPACITY AND PERFORMANCE

摘要

Chip die sizes continue to grow, as does the number of connections. The switch to high-speed serial interfaces reduced the required pin count, but that simply slowed the pin count down. Dual inline packages (DIPs) used to be the mainstay for the electronics industry, and many applications still use them. They worked well with sockets and circuit boards. Through-hole connections allowed double-sided and then multilayer boards. The problem is that DIPs hit limitations as they scaled down in size and the number of connections rose. These days, surface-mount technology (SMT) has become the primary way to utilize electronic components.