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MOVPE-grown millimeter-wave InGaAs mixer diode technology and characteristics

机译:MOVPE生长的毫米波InGaAs混频器二极管技术和特性

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摘要

The merits of InGaAs-based millimeter-wave mixer diodes are explored experimentally and theoretically. Schottky junctions on InGaAs exhibit barriers (/spl phi//sub b/) in the neighborhood of 0.25 eV. The high mobility of InGaAs contributes to the low n/sup +/ sheet resistances of 1.9-5 /spl Omega//square for 1-/spl mu/m n/sup +/ InGaAs layers (n/sub s/=1.5/spl times/10/sup 19/ cm/sup -3/, /spl mu//sub n/=1800 cm/sup 2//V/spl middot/s) grown with our in-house Metalorganic Vapor Phase Epitaxy (MOVPE) system, The design, material growth, fabrication, and characterization of InGaAs integrated mixer/antennae are reported. Pt plating technology, adapted here for InGaAs Schottky contacts, has improved the ideality factor (/spl eta/) and yield relative to conventional evaporated Pt. With 810 /spl mu/W of local oscillator power, applied to the diode, and zero DC bias, an integrated InGaAs mixer/antenna demonstrated an excellent diode performance of 199 K RF input double-sideband noise temperature with a corresponding single-sideband (SSB) conversion loss (L/sub c/) of 5.0 dB at LO, RF, and IF frequencies of 94 GHz, 94 GHz/spl plusmn/1.4 GHz, and 1.4 GHz, respectively. Likewise, the diodes in an InGaAs subharmonic integrated mixer/antenna demonstrated an equivalent RF-port double-sideband (DSB) noise temperature (T/sub mix/) of 1058 K and single-sideband conversion loss of 10.2 dB at 180 GHz with a 90-GHz LO power (PLO) of 1.6 mW. Compared to GaAs diodes with RF coupling and IF losses removed, the single-ended InGaAs noise temperature results were within 46-100 K of those for state-of-the-art GaAs mixer diodes while requiring significantly less LO power.
机译:实验和理论上探索了基于InGaAs的毫米波混频器二极管的优点。 InGaAs上的肖特基结在0.25 eV附近表现出势垒(/ spl phi // sub b /)。 InGaAs的高迁移率导致1- / spl mu / mn / sup + / InGaAs层的低n / sup + /薄层电阻为1.9-5 / spl Omega // square(n / sub s / = 1.5 / spl使用我们内部的金属有机气相外延(MOVPE)成长的/ 10 / sup 19 / cm / sup -3 /,/ spl mu // sub n / = 1800 cm / sup 2 // V / spl middot / s)报道了InGaAs集成混频器/天线的设计,材料生长,制造和特性。此处适用于InGaAs肖特基接触的Pt电镀技术相对于传统的蒸发Pt改善了理想因子(/ spl eta /)和良率。集成的InGaAs混频器/天线在二极管上施加了810 / spl mu / W的本地振荡器功率,并且直流偏置为零,因此具有出色的二极管性能,具有199 K的RF输入双边带噪声温度和相应的单边带(在94 GHz,94 GHz / spl plusmn / 1.4 GHz和1.4 GHz的LO,RF和IF频率下,SSB)转换损耗(L / sub c /)分别为5.0 dB。同样,InGaAs次谐波集成混频器/天线中的二极管在180 GHz频率下的等效射频端口双边带(DSB)噪声温度(T / sub mix /)为1058 K,单边带转换损耗为10.2 dB。 90 GHz本振功率(PLO)为1.6 mW。与消除了射频耦合和IF损耗的GaAs二极管相比,单端InGaAs噪声温度结果与最新型GaAs混频器二极管的结果相差46-100 K,同时所需的LO功率也大大降低。

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