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首页> 外文期刊>IEEE Transactions on Electron Devices >Design, fabrication, and analysis of SiGeC heterojunction PMOSFETs
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Design, fabrication, and analysis of SiGeC heterojunction PMOSFETs

机译:SiGeC异质结PMOSFET的设计,制造和分析

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We present the evaluation of the strain-stabilizing capabilities of C in the Si/sub 1-x/Ge/sub x/ system. To demonstrate these effects, we have designed Si/sub 1-x-y/Ge/sub x/C/sub y/ heterojunction PMOSFET devices over a range of Ge concentrations, with thicknesses that would typically result in related or metastable films under normal processing conditions. The dc characteristics of Si/sub 1-x-y/Ge/sub x/C/sub y/, SiCe, and Si PMOSFETs (L=10 /spl mu/m) were evaluated at room temperature and at 77 K. In general, the saturation mobility in Si/sub 1-x-y/Ge/sub x/C/sub y/ devices is higher than that of Si/sub 1-x/Ge/sub x/ and Si devices at low gate bias and room temperature. This enhancement is attributed to the strain stabilization effect of C. With proper optimization of Ge and C concentrations, it is possible to fabricate devices with significant improvements in drive current under normal operating conditions (0-3 V, 300 K). This application of Si/sub 1-x-y/Ge/sub x/C/sub y/ in PMOSFETs demonstrates the potential benefits of using of C in the Column IV heterostructure system.
机译:我们目前对Si / sub 1-x / Ge / sub x /系统中C的应变稳定能力进行评估。为了证明这些效果,我们设计了在一定的Ge浓度范围内的Si / sub 1-xy / Ge / sub x / C / sub y /异质结PMOSFET器件,其厚度通常会在正常加工条件下产生相关或亚稳态的膜。在室温和77 K下评估了Si / sub 1-xy / Ge / sub x / C / sub y /,SiCe和Si PMOSFET(L = 10 / spl mu / m)的直流特性。在低栅极偏置和室温下,Si / sub 1-xy / Ge / sub x / C / sub y /器件的饱和迁移率高于Si / sub 1-x / Ge / sub x /和Si器件。这种增强归因于C的应变稳定作用。通过适当优化Ge和C的浓度,可以制造出在正常工作条件(0-3 V,300 K)下驱动电流得到显着改善的器件。 Si / sub 1-x-y / Ge / sub x / C / sub y /在PMOSFET中的这种应用展示了在列IV异质结构系统中使用C的潜在好处。

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