$(V_{T})$ distribution in Flash electrically erasable programmable read-only memory cells was investigated versus the tu'/> Edge Profile Effect of Tunnel Oxide on Erase Threshold-Voltage Distributions in Flash Memory Cells
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Edge Profile Effect of Tunnel Oxide on Erase Threshold-Voltage Distributions in Flash Memory Cells

机译:隧道氧化物的边缘轮廓效应对闪存单元中擦除阈值电压分布的影响

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摘要

The erase threshold-voltage $(V_{T})$ distribution in Flash electrically erasable programmable read-only memory cells was investigated versus the tunnel oxide edge profiles in self-aligned shallow trench isolation (SA-STI) and self-aligned poly (SAP) cells. The capacitive coupling with offset voltage correction is transcribed into $V_{T}$ transient for simulating erase $V_{T}$ dispersion without numerous full structure device simulations. It is shown that SAP gives rise to smaller $V_{T}$ dispersion, compared with SA-STI. The $V_{T}$ dispersion resulting from variations in dielectric thickness and oxide edge profiles is shown to fall far short of observed $V_{T}$ distribution, calling for examination of additional process and cell parameters.
机译:研究了闪存电可擦可编程只读存储单元中的擦除阈值电压 $(V_ {T})$ 分布与隧道氧化物边缘的关系自对准浅沟槽隔离(SA-STI)和自对准多晶硅(SAP)单元中的剖面图。具有偏移电压校正的电容耦合被转录为 $ V_ {T} $ 瞬态,用于模拟擦除 $ V_ {T} $ 分散,而无需进行大量的全结构器件仿真。结果表明,与SA-STI相比,SAP产生的 $ V_ {T} $ 色散较小。由介电层厚度和氧化物边缘轮廓的变化导致的 $ V_ {T} $ 色散显示远远低于观察到的 $ V_ {T} $ 分布,要求检查其他过程和单元参数。

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