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首页> 外文期刊>Electron Devices, IEEE Transactions on >Correlation of Charge Buildup and Stress-Induced Leakage Current in Cerium Oxide Films Grown on Ge (100) Substrates
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Correlation of Charge Buildup and Stress-Induced Leakage Current in Cerium Oxide Films Grown on Ge (100) Substrates

机译:Ge(100)衬底上生长的氧化铈薄膜中电荷积累与应力诱导的漏电流的相关性

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High-$kappa$ films are currently deposited on Ge substrates to compensate the mobility loss, as Ge offers higher mobility compared with that of silicon. This paper deals with the reliability characteristics of cerium oxide films grown by molecular beam deposition on n-type Ge (100) substrates. MOS capacitors with Pt gate electrodes were subjected to constant voltage stress conditions at accumulation. The correlation of the charge-trapping characteristics and the stress-induced leakage current (SILC) to the applied field is observed and analyzed. The results suggest that one major problem for the potential use of rare earth oxides in future MOS technology is the existence of relaxation effects. The cross-sectional value of the bulk oxide traps is on the order of $hbox{10}^{-18} hbox{cm}^{2}$ , thus indicating neutral defects. Direct comparison to reported results on high- $kappa/hbox{Si}$ and $ hbox{SiO}_{2}/hbox{Si}$ structures shows that SILC properties are related to the quality of the dielectric layers; the semiconductor substrate is immaterial.
机译:目前,高Ge薄膜被沉积在Ge衬底上以补偿迁移率损失,因为与硅相比,Ge具有更高的迁移率。本文探讨了通过分子束沉积在n型Ge(100)衬底上生长的氧化铈薄膜的可靠性特征。具有Pt栅电极的MOS电容器在积累时经受恒定的电压应力条件。观察并分析了电荷俘获特性和应力感应泄漏电流(SILC)与施加电场的相关性。结果表明,在未来的MOS技术中潜在使用稀土氧化物的一个主要问题是松弛效应的存在。本体氧化物阱的横截面值约为$ hbox {10} ^ {-18} hbox {cm} ^ {2} $,从而指示出中性缺陷。与高kappa / hbox {Si} $和$ hbox {SiO} _ {2} / hbox {Si} $结构的报告结果进行直接比较表明,SILC特性与介电层的质量有关。半导体衬底是无关紧要的。

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