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首页> 外文期刊>Electron Devices, IEEE Transactions on >Device-Circuit Analysis of Double-Gate MOSFETs and Schottky-Barrier FETs: A Comparison Study for Sub-10-nm Technologies
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Device-Circuit Analysis of Double-Gate MOSFETs and Schottky-Barrier FETs: A Comparison Study for Sub-10-nm Technologies

机译:双栅极MOSFET和肖特基势垒FET的器件电路分析:10纳米以下技术的比较研究

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摘要

In this paper, we explore the design space of two possible candidate FETs for sub-10-nm technologies—FinFET like double gate MOSFETs (DGFETs) and Schottky-barrier (SB) devices. Though SB devices are expected to have lower ON current, their lower source/drain resistance () can be important in scaled technologies. We evaluate the suitability of the optimized devices for logic and memory designs in the sub-10-nm technologies using a comparative device-circuit analysis based on nonequilibrium Green’s function-based transport models and HSPICE circuit simulation. The devices are optimized with gate-to-source ()/drain () underlap, and proper body thickness to suppress direct source-to-drain tunneling (DSDT). Our analysis shows that introduction of gate-to- underlap provides the benefit of reducing DSDT, while reduced body thickness provides a tradeoff between low DSDT and high . Results also show that DGFETs provide higher drive strength even with larger . As a result, DGFET-based logic shows higher performance, and better read stability for memory while SBFET-based memory shows higher write stability.
机译:在本文中,我们探索了10nm以下技术的两种可能的FET的设计空间-FinFET,如双栅极MOSFET(DGFET)和肖特基势垒(SB)器件。尽管预计SB器件的ON电流较低,但其较低的源极/漏极电阻()在规模化技术中可能很重要。我们使用基于非平衡Green功能的传输模型和HSPICE电路仿真的比较器件电路分析,评估了10纳米以下技术中用于逻辑和存储器设计的优化器件的适用性。该器件经过优化,具有栅极至源极()/漏极()的重叠,并具有适当的主体厚度,可抑制直接的源极至漏极隧穿(DSDT)。我们的分析表明,引入栅极至下叠层的好处在于降低了DSDT,而减小的车身厚度则在低DSDT和高DSDT之间进行了权衡。结果还表明,即使更大,DGFET仍可提供更高的驱动强度。结果,基于DGFET的逻辑显示了更高的性能,并且为存储器提供了更好的读取稳定性,而基于SBFET的存储器则显示了更高的写入稳定性。

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