机译:接触条件对铜和铟热接触电阻影响的研究
Huazhong Univ Sci & Technol Sch Mech Sci & Engn Wuhan 430074 Peoples R China;
Huazhong Univ Sci & Technol Sch Mech Sci & Engn Wuhan 430074 Peoples R China;
Huazhong Univ Sci & Technol Sch Mech Sci & Engn Wuhan 430074 Peoples R China;
Huazhong Univ Sci & Technol Sch Mech Sci & Engn Wuhan 430074 Peoples R China;
Huazhong Univ Sci & Technol Sch Mech Sci & Engn Wuhan 430074 Peoples R China;
Indium; Thermal resistance; Copper; Surface roughness; Rough surfaces; Surface topography; Electronic packaging thermal management; Electronic packaging thermal management; fractals; thermal analysis; thermal contact resistance (TCR);
机译:铟涂层蓝宝石-铜触点的热阻低于0.1 K
机译:低温下压铜和镀金铜接触 - 热接触电阻综述
机译:电流流动条件下表观接触面积对硬拉铜接触线和铁基烧结合金接触片磨损性能的影响
机译:微动条件下离子注入对铜和银-铜电接触接触电阻的影响。
机译:弹性体对金属触点的热接触电阻。
机译:皮肤厚度和热接触电阻如何影响热触觉
机译:表观接触区域对电流流动条件下硬拔铜接触线和铁基烧结合金接触条带的磨损性能
机译:铜硅界面上的热接触电阻