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A Highly Scalable Junctionless FET Leaky Integrate-and-Fire Neuron for Spiking Neural Networks

机译:用于尖峰神经网络的高度可扩展的连接FET漏水整合和防火神经元

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In this article, a highly scalable and CMOS compatible double-gate junctionless field-effect transistor (DG-JLFET)-based leaky integrate-and-fire (LIF) neuron is presented for the sub-20 nm gate length which is the smallest reported until now. Using well-calibrated 2-D TCAD simulations, we demonstrated that DG-JLFET LIF is able to mimic biological neuronal behavior. The DG-JLFET LIF neuron shows a low threshold voltage (-0.31 V) for firing a spike and requires 1.14 pJ of energy per spike which is similar to 32 x less than partially depleted silicon-on-insulator (PD-SOI) MOSFET LIF neuron. The proposed neuron needs only 0.4 V of supply voltage that is similar to 7 x , 7.5 x , 5 x , and 2 x lower as compared to its counterpart PD-SOI MOSFET, FinFET, L-shaped bipolar impact ionization MOS (LBIMOS), and Si NIPIN Diode-based LIF neurons, respectively. In addition, at a gate length of 10 nm the DG-JLFET LIF requires 0.07 pJ of energy per spike, which is similar to 500 x , similar to 642 x , and similar to 86 x lower than that of the PD-SOI MOSFET, single MOSFET and Biristor based LIF neurons, respectively. Moreover, the DG-JLFET LIF neuron shows spiking frequency in the range of megahertz, which is similar to 5 orders high compared to the biological neuron. The absence of metallurgical junctions in DG-JLFET eases the fabrication complexity and cuts down the thermal budget requirement.
机译:在本文中,为子20 nm栅极长度提出了高度可扩展和CMOS兼容的双栅连接场效应晶体管(DG-JLFET)被漏出的整合和火(LIF)神经元,其报告最小到现在。使用校准的2-D TCAD模拟,我们证明DG-JLFET LIF能够模仿生物神经元行为。 DG-JLFET LIF Neuron显示出次峰值的低阈值电压(-0.31V),每个峰值需要1.14pj的能量,其类似于32 x,而不是部分耗尽的绝缘体(PD-SOI)MOSFET LIF神经元。所提出的神经元仅需0.4V,电源电压类似于7 x,7.5 x,5 x和2 x,与其对应PD-SOI MOSFET,FINFET,L形双极冲击电离MOS(LBIMOS)相比,和Si nipin二极管的生命神经元分别。另外,在10nm的栅极长度下,每个尖峰需要0.07pj的能量,其类似于500 x,类似于642 x,并且类似于86 x低于PD-SOI MOSFET的86 x,单一MOSFET和BIRISTOR为基础的生命神经元。此外,DG-JLFET LIF Neuron在兆赫的范围内显示出尖峰频率,与生物神经元相比,与5个次数相似。在DG-JLFET中没有冶金结的情况会减轻制造复杂性并减少热预算要求。

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