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首页> 外文期刊>IEEE Electron Device Letters >Full functionality of LSI gate arrays fabricated on 3-in-diameter, MOCVD-grown GaAs-on-silicon substrates
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Full functionality of LSI gate arrays fabricated on 3-in-diameter, MOCVD-grown GaAs-on-silicon substrates

机译:在直径3英寸,MOCVD生长的硅上GaAs衬底上制造的LSI门阵列的全部功能

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Fully functional, 504-gate arrays have been fabricated on an MOCVD (metalorganic chemical-vapor deposition)-grown, 3-in-diameter, GaAs-on-silicon substrate. Each ECL (emitter-coupled-logic)-compatible gate array consists of an eight-bit adder, a D flip-flop, a 214 divider (with a divide-by-four tap), and a 263-stage inverter string. These circuits represent 90% gate utilization, or approximately 6600 transistors. The wafer-level yield of fully functional gate arrays is 10.7%. This demonstrates total functionality and yield for a digital circuit with LSI-level complexity using MOCVD-grown GaAs-on-silicon material and shows that this material, even with defect densities greater than 108 cm/sup -2/, is viable for high-density LSI circuits.
机译:功能齐全的504门阵列已在MOCVD(金属有机化学气相沉积)生长的直径3英寸硅上GaAs衬底上制造。每个兼容ECL(发射极耦合逻辑)的门阵列均由一个8位加法器,一个D触发器,一个214分频器(带有四分频抽头)和一个263级反相器串组成。这些电路代表90%的栅极利用率,或大约6600个晶体管。全功能门阵列的晶圆级成品率为10.7%。这证明了使用MOCVD生长的硅基砷化镓材料制成的具有LSI级复杂度的数字电路的总体功能和良率,并表明即使缺陷密度大于108 cm / sup -2 /,这种材料也可用于高密度的半导体材料。密度LSI电路。

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