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首页> 外文期刊>IEEE Electron Device Letters >Impact of Stress Mode on Stochastic BTI in Scaled MG/HK CMOS Devices
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Impact of Stress Mode on Stochastic BTI in Scaled MG/HK CMOS Devices

机译:应力模式对MG / HK CMOS器件中随机BTI的影响

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摘要

Stochastic bias temperature instability (BTI) modeling has gained importance for scaled metal gate/high-$k$ CMOS devices to ensure SRAM circuit functionality. In this letter, we discuss the impact of the BTI stress mode on the $Delta V_{T}$ distribution and the time evolution of $V_{T}$ in small and large area CMOS devices. It is shown that the stress mode has strong impact on the evolution of the threshold voltage distribution in small area devices leading to an increase in the $sigma$-value for constant overdrive stress, whereas no change is observed for constant voltage stress. Since CMOS circuits share the supply voltage, the constant voltage stress $sigma$-values are relevant and thus, the reliability guidance for future CMOS design should be based on constant voltage stress.
机译:随机偏置温度不稳定性(BTI)建模对于缩放金属栅极/高k $ CMOS器件以确保SRAM电路功能已变得越来越重要。在这封信中,我们讨论了小面积和大面积CMOS器件中BTI应力模式对$ Delta V_ {T} $分布的影响以及$ V_ {T} $的时间演变。结果表明,应力模式对小面积器件中阈值电压分布的演变有很大影响,导致恒定过驱动应力的σ值增加,而恒定电压应力则未观察到变化。由于CMOS电路共享电源电压,因此恒定电压应力$ sigma $值是相关的,因此,未来CMOS设计的可靠性指南应基于恒定电压应力。

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