首页> 外文期刊>Electromagnetic Compatibility, IEEE Transactions on >Worst Case-Induced Disturbances in Microstrip Interchip Interconnects by an External Electromagnetic Plane Wave—Part II: Analysis and Validation
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Worst Case-Induced Disturbances in Microstrip Interchip Interconnects by an External Electromagnetic Plane Wave—Part II: Analysis and Validation

机译:外部电磁平面波在微带线芯片互连中引起最坏情况的干扰—第二部分:分析和验证

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摘要

In the companion paper [1], an algorithm to calculate the worst case-induced voltages at the terminations of a uniform microstrip line illuminated by an electromagnetic plane wave has been presented. Here, this algorithm is used to calculate the worst case voltage at the ends of a microstrip line terminated by real analog and digital transceivers. Specifically, the influence of the microstrip design parameters and termination impedances on the induced voltage magnitude is analyzed and some design criteria are pointed out.
机译:在随附的论文[1]中,提出了一种计算在电磁平面波照射下的均匀微带线的端点处最坏情况下感应电压的算法。在这里,该算法用于计算由真实模拟和数字收发器端接的微带线末端的最坏情况电压。具体来说,分析了微带设计参数和端接阻抗对感应电压幅值的影响,并指出了一些设计准则。

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