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A New Methodology for EMC Prediction of Integrated Circuits After Aging

机译:老化后集成电路EMC预测的新方法

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摘要

Electromagnetic compatibility (EMC) of integrated circuits (ICs) represents a major constraint for the qualification of electronic circuits. Today, there exist standardized models such as integrated circuit emission model for conducted emissions (ICEM-CE) that allows the prediction of conducted emission generated by an IC at a printed circuit board (PCB) level. However, the EMC levels may change after a certain period of operation due to the aging of components. On the other hand, no existing model or tool can predict the long-term EMC levels. This paper presents a new methodology for modeling of ICs in order to construct an EMC model, which takes into account the aging based on a new reliability model called MultiphySics mulTistressOrs predictive Reliability Model (M-STORM).
机译:集成电路(IC)的电磁兼容性(EMC)代表了电子电路鉴定的主要限制。如今,存在标准化模型,例如用于传导发射的集成电路发射模型(ICEM-CE),该模型可以预测IC在印刷电路板(PCB)级别产生的传导发射。但是,由于组件的老化,EMC级别在运行一定时间后可能会发生变化。另一方面,现有的模型或工具都无法预测长期的EMC水平。本文提出了一种用于建模IC的新方法,以构建一个EMC模型,该模型考虑了基于称为MultiphySics mulTistressOrs预测可靠性模型(M-STORM)的新可靠性模型的老化。

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