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首页> 外文期刊>Electromagnetic Compatibility, IEEE Transactions on >Measurement and Analysis of Statistical IC Operation Errors in a Memory Module Due to System-Level ESD Noise
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Measurement and Analysis of Statistical IC Operation Errors in a Memory Module Due to System-Level ESD Noise

机译:系统级ESD噪声导致的内存模块中统计IC操作错误的测量和分析

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摘要

Voltage noise and operation errors in an integrated circuit (IC) due to electrostatic discharge (ESD) events were measured, validated, and analyzed in this paper. A simplified structure of a laptop personal computer and an IC with a D-type flip-flop were designed and manufactured for the experimental tests. Every signal input to the IC was simultaneously measured during the ESD tests, and validated with the simulated results using a full-wave solver and a simple circuit model. Next, SPICE simulations were conducted using the measured voltages with ESD tests. The output waveforms and the statistical occurrence ratios of the operation failures found from the SPICE simulations were compared with measured values. Furthermore, the effects of decoupling capacitors on the IC operation failures due to ESD were investigated.
机译:本文测量,验证和分析了由于静电放电(ESD)事件引起的集成电路(IC)中的电压噪声和操作错误。设计并制造了膝上型个人计算机的简化结构和带有D型触发器的IC,用于实验测试。在ESD测试期间,同时测量了输入到IC的每个信号,并使用全波求解器和简单的电路模型对仿真结果进行了验证。接下来,使用测得的电压和ESD测试进行了SPICE仿真。将通过SPICE仿真发现的输出波形和操作失败的统计发生率与测量值进行比较。此外,还研究了去耦电容器对由于ESD引起的IC工作故障的影响。

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