Master Bond EP30FL is a two component, flexibilized epoxy potting/encapsulation compound for high performance applications. EP30FL has superior electrical insulation properties and resistance to impact. It is formulated to cure at room temperatures and has exceptionally low shrinkage after cure. It has high bond strength to similar and dissimilar substrates and will resist 4K to 250°F. Resistance to thermal cycling and shock is outstanding. Master Bond offers a wide variety of one and two component epoxy systems for adhesive, sealing and coating applications. Special grades are electrically conductive, thermally conductive/electrically insulative, optically clear, NASA low outgassing approved and mechanical shock resistant.
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机译：Master Bond EP30FL是用于高性能应用的两组分，增韧的环氧灌封/封装化合物。 EP30FL具有出色的电绝缘性能和抗冲击性。它经配制可在室温下固化，固化后收缩率极低。它对相似和不相似的基材具有很高的粘合强度，可抵抗4K至250°F的温度。出色的抗热循环和冲击性能。 Master Bond提供多种用于粘合剂，密封和涂料应用的一组分和二组分环氧体系。特殊等级的产品具有导电性，导热性/绝缘性，光学透明性，NASA认可的低脱气性和抗机械冲击性。
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