Adhesive Has High Peel & Shear Strength

摘要

Master Bond two-part epoxy EP21TDC has been developed specifically to bond substrates with large differences in thermal expansion coefficients. The EP21TDC epoxy resin system furthermore features very high peel strength after room temperature cure. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -300°F to more than 250°F. It also has a non-critical 1 to 1 mix ratio by weight or volume. Master Bond offers a wide variety of one and two component epoxy systems for adhesive, sealing, and coating applications. Special grades are electrically conductive, thermally conductive/electrically insulative, optically clear, NASA low outgassing approved and mechanical shock resistant.