Everything matters

摘要

The recent IEEE CPMT (Components, Packaging, and Manufacturing Technology Society) meeting in Portland, OR, produced a plethora of papers documenting interactions among sys-tem architecture, signal quality, RF interference, power-system noise, thermal dissipation, size, weight, cost, and numerous other factors. Here's a sampling of subjects that keep those folks up at night: 1. the concept of dissipating 2700W in a highly packed mechan-ical structure; 2. that the complexity of a prob-lem described in its raw geometry is, for the purpose of modeling, overwhelming; 3. the nonlinear effects of the noise interaction between simulta-neously switching noise, common-mode noise, and crosstalk; and 4. the uncompromised modeling of the power grid during switching (references 1 through 4, respec-tively).