Flexible Backplane Design: Incorporating Maximum Functi in Densely Packaged Systems

摘要

Densely packaged chassis for embedded systems are common in today's environment. The drive to lower-cost scalability presents continuing challenges to the systems platform designer. Because of the need to balance airflow, cable routing, system management integration, high bandwidth and environmental considerations in less and less space, flexibility and creativity in design is essential. Although embedded specifications for VME, cPCI, ATCA and switched fabrics provide a framework for compatibility, there remain numerous nuances in backplane and chassis design that are required to ensure an optimized system.