Problem Solving with the PCB Co-Planar SMT Conner

摘要

Surface Mounting is the fastest growing technology in electronics today. This is due first to the great potential for assembly cost savings generated by the increase of PCB component density, board surface utilization and routing density, and secondly, to the elimination of board damage factors such as fiber fracture, friction forces of pin insertion or trace distortion. Certainly, solder joint reliability issues increased with the shift of the through-hole towards re-flow technology. Solder joint robustness characteristics decreased and it is usually much more difficult to maintain, especially from the standpoint of the CTE (Coefficient of Thermal Expansion) variations. Since the TB (Terminal Block) type of interconnect products are frequently larger than the other passive or active elements, the mechanical properties of the solder joint are less reliable for SMT applications compared to the THWS (Through Hole for Wave Solder) or THR (Through Hole Re-flow) applications. Regarding miniaturization, the TB interconnect could not follow the improvement at the same pace as it was for the majority of other components for SMT applications.