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首页> 外文期刊>Acta Materialia >TENSILE TESTING OF FREE-STANDING Cu, Ag AND Al THIN FILMS AND Ag/Cu MULTILAYERS
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TENSILE TESTING OF FREE-STANDING Cu, Ag AND Al THIN FILMS AND Ag/Cu MULTILAYERS

机译:游离Cu,Ag和Al薄膜和Ag / Cu多层薄膜的拉伸测试

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摘要

Free standing polycrystalline thin films with a strong〈111〉texture were tested in uniaxial ten- sion. Studied were electron-beam deposited Ag, Cu and Al films, and Ag/Cu multilayers consisting of alter- nating Ag and Cu layers of equal thickness, between 1.5 nm and 1.5μm(bilayer repeat length, γ, between 3 nm and 3μm). The films had a total thickness of about 3μm. A thin polymeric two-dimensional diffrac- tion grid was deposited on the film surface by microlithographic techniques.
机译:在单轴张力下测试了具有强<111>纹理的自立式多晶薄膜。研究了电子束沉积的Ag,Cu和Al膜,以及由交替厚度相等的Ag和Cu层组成的Ag / Cu多层膜,厚度在1.5 nm至1.5μm之间(双层重复长度γ在3 nm至3μm之间) 。膜的总厚度为约3μm。通过微光刻技术将薄的聚合物二维衍射网格沉积在薄膜表面上。

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