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首页> 外文期刊>Acta Materialia >ON THE USE OF THE MICROMARKER TECHNIQUE FOR STUDYING THE GROWTH MECHANISM OF THIN OXIDE FILMS
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ON THE USE OF THE MICROMARKER TECHNIQUE FOR STUDYING THE GROWTH MECHANISM OF THIN OXIDE FILMS

机译:利用微标记技术研究氧化薄膜的生长机理

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The high temperature behavior of microscopic markers, deposited on to pure and ceria-coated nickel, was tested. The markers, having a form of 20-nm-thick palladium bumps with a fractional surface coverage of 0.05 and 30-nm thick gold bumps with a surface coverage of 0.25, apparently interfered with the oxide growth, increasing the oxidation rate on their surface at 973 K over one order of magnitude. As detected by a combination of Auger electron spectroscopy and Rutherford backscattering spectrometry, for ceria modified nickel, the markers' depth-position coincided with the ceria particles dispersed in the vicinity of the oxide-gas interface. For pure nickel oxide films, the markers were easily incorporated into the grow- ing oxide during very early stages of oxidation and were difficult to detect at the oxide-metal interface. It is proposed that the catalytic behavior of the markers was caused by their fragmentation into a large num- ber of islands, leading to the refinement of the oxide grains, which in turn accelerated the substrate oxi- dation rate. Some precautions necessary in conducting the marker experiments are defined.
机译:测试了沉积在纯镍和二氧化铈涂层镍上的微观标记的高温行为。这些标记物具有20 nm厚的钯凸块形式,具有0.05的部分表面覆盖率和30 nm厚的金凸块具有0.25的表面覆盖率,显然干扰了氧化物的生长,从而增加了其表面的氧化速率。在一个数量级上为973K。通过俄歇电子能谱和卢瑟福背散射光谱法的组合检测,对于氧化铈改性的镍,标记物的深度位置与分散在氧化物-气体界面附近的氧化铈颗粒重合。对于纯氧化镍膜,标记在氧化的很早阶段就很容易掺入到正在生长的氧化物中,并且很难在氧化物-金属界面处检测到。有人提出,标记物的催化行为是由于它们破碎成大量的岛而引起的,从而导致了氧化物颗粒的细化,进而加速了底物的氧化速率。定义了进行标记实验所需的一些预防措施。

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