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Triple module redundancy reliability framework design based on heterogeneous multi-core processor

机译:基于异构多核处理器的三模块冗余可靠性框架设计

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To solve the problem of commercial device with weak anti-SEU ability and traditional radiation hardened device with slow processing speed, this article proposes a novel system-level collaborative triple module redundancy (TMR) design to mitigate single event upset (SEU) on the advanced heterogeneous processor. Based on Xilinx Zynq Ultrascale+ MPSoC, we combine TMR with rolling back, watchdog and scrubbing technique between heterogeneous cores which are Arm Cortex-A53 and Field Programmable Gate Array (FPGA). This combination brings us a promising result of fault identification and correction according to the simulation of the single channel data fault and the double channel data fault. It costs 27%-44% more time to process error and the system has relatively low resource utilization rate and power consumption. Moreover, it can also apply to general heterogeneous quad-core System on Chip (SoC) with FPGA processor’s anti-SEU design and provides some ideas for further study of system level radiation-resistant chips’ design.
机译:为了解决弱化抗SEU能力和传统辐射硬化装置的商业设备问题,加工速度较慢,提出了一种新颖的系统级协作三重模块冗余(TMR)设计,以缓解高级事件令人不安(SEU)异构处理器。基于Xilinx Zynq UltraScale + MPSOC,我们将TMR与异构核心之间的滚动,看门狗和擦洗技术相结合,这些核心是ARM Cortex-A53和现场可编程门阵列(FPGA)的异构核心。根据单通道数据故障的仿真和双通道数据故障,该组合为您带来了故障识别和校正的承诺结果。处理误差的时间有27%-44%,系统具有相对较低的资源利用率和功耗。此外,它还可以应用于芯片(SOC)的一般异构四核系统,具有FPGA处理器的防苏设计,并为进一步研究系统级辐射芯片设计提供了一些思想。

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