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Structural basis of TFIIH activation for nucleotide excision repair

机译:TFIIH激活核苷酸切除修复的结构基础

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摘要

Nucleotide excision repair (NER) is the major DNA repair pathway that removes UV-induced and bulky DNA lesions. There is currently no structure of NER intermediates, which form around the large multisubunit transcription factor IIH (TFIIH). Here we report the cryo-EM structure of an NER intermediate containing TFIIH and the NER factor XPA. Compared to its transcription conformation, the TFIIH structure is rearranged such that its ATPase subunits XPB and XPD bind double- and single-stranded DNA, consistent with their translocase and helicase activities, respectively. XPA releases the inhibitory kinase module of TFIIH, displaces a 'plug' element from the DNA-binding pore in XPD, and together with the NER factor XPG stimulates XPD activity. Our results explain how TFIIH is switched from a transcription to a repair factor, and provide the basis for a mechanistic analysis of the NER pathway.
机译:核苷酸切除修复(ner)是可去除紫外线诱导和庞大的DNA病变的主要DNA修复途径。目前没有Ner中间体的结构,其围绕大的多相转录因子IIH(TFIIH)形成。在这里,我们报告了含有TFIIH和NER因子XPA的Ner中间体的冷冻组织结构。与其转录构象相比,重新排列TFIIH结构,使得其ATP酶亚基XPB和XPD分别与其夸象和螺旋酶活性相一致的双链和单链DNA。 XPA释放TFIIH的抑制激酶模块,从XPD中从DNA结合孔取代“插头”元素,并与Ner因子XPG一起刺激XPD活性。我们的结果解释了TFIIH如何从转录到修复因子转换,并为Ner途径的机械分析提供基础。

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