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Effects of aging and thermal cycling on the microstructure and damping behaviors of a porous CuAlMn shape memory alloy

机译:老化和热循环对多孔Cualmn形状记忆合金的微观结构和阻尼行为的影响

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Effects of aging and thermal cycling on the microstructure and damping behaviors of a porous CuAlMn shape memory alloy (SMA) were studied. It was found that with increasing aging temperature the intensity of the internal friction peak initially increased, followed by a decrease in the reverse martensitic transformation. In addition, the peak position shifted from low temperature to high temperature. This phenomenon has been ascribed to the refinement of martensitic laths as well as the annihilation of the quenched-in vacancies. The process of thermal cycling was also found to influence the damping behaviors of porous CuAlMn SMA. For instance, the damping behaviors of the alloys at ambient temperatures were observed to gradually increase, when subjected to 10 thermal cycles. However, when the thermal cycles exceeded above 20, the damping capacity began to decrease due to the newly generated dislocations and the disappearance of the spear-shaped martensite phase.
机译:研究了老化和热循环对多孔Cualmn形状记忆合金(SMA)的微观结构和阻尼行为的影响。发现随着老化温度的增加,内部摩擦峰的强度最初增加,然后降低了反向马氏体转化。另外,峰值位置从低温转移到高温。这种现象已经归因于马氏体车道的改进以及淬火空位的湮灭。还发现热循环过程以影响多孔Cualmn SMA的阻尼行为。例如,观察到环境温度下合金的阻尼行为逐渐增加,当受到10个热循环时逐渐增加。然而,当高于20的热循环时,由于新产生的脱位和矛形马氏体相消失,阻尼能力开始减少。

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