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KDP Aqueous Solution-in-Oil Microemulsion for Ultra-Precision Chemical-Mechanical Polishing of KDP Crystal

机译:KDP含水溶液内微乳液,用于KDP晶体的超精密化学机械抛光

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A novel functional KH 2 PO 4 (KDP) aqueous solution-in-oil (KDP aq/O) microemulsion system for KDP crystal ultra-precision chemical-mechanical polishing (CMP) was prepared. The system, which consisted of decanol, Triton X-100, and KH 2 PO 4 aqueous solution, was available at room temperature. The functional KDP aq/O microemulsion system was systematically studied and applied as polishing solution to KDP CMP technology. In this study, a controlled deliquescent mechanism was proposed for KDP polishing with the KDP aq/O microemulsion. KDP aqueous solution, the chemical etchant in the polishing process, was caged into the micelles in the microemulsion, leading to a limitation of the reaction between the KDP crystal and KDP aqueous solution only if the microemulsion was deformed under the effect of the external force. Based on the interface reaction dynamics, KDP aqueous solutions with different concentrations ( c KDP ) were applied to replace water in the traditional water-in-oil (W/O) microemulsion. The practicability of the controlled deliquescent mechanism was proved by the decreasing material removal rate (MRR) with the increasing of the c KDP . As a result, the corrosion pits on the KDP surface were avoided to some degree. Moreover, the roughnesses of KDP with KDP aq/O microemulsion ( c KDP was changed from 10 mM to 100 mM) as polishing solutions were smaller than that with the W/O microemulsion. The smallest surface root-mean-square roughness of 1.5 nm was obtained at a 30 mmol/L KDP aq solution, because of the most appropriate deliquescent rate and MRR.
机译:制备了一种新型功能性KH 2 PO 4(KDP)水溶液(KDP)水溶液(KDP AQ / O)微乳液系统,用于KDP晶体超精密化学机械抛光(CMP)。由癸醇,Triton X-100和KH 2 PO 4水溶液组成的系统可在室温下获得。系统地研究了功能性KDP AQ / O微乳液系统并将其应用于KDP CMP技术的抛光溶液。在该研究中,用KDP AQ / O微乳液提出了一种受控的潮解机理,用于KDP抛光。 KDP水溶液,抛光过程中的化学蚀刻剂被捕获到微乳液中的胶束中,导致KDP晶体和KDP水溶液之间的反应仅在外力的效果下变形。基于界面反应动力学,施用具有不同浓度(C KDP)的KDP水溶液以替代传统水油状微型乳液中的水。通过降低的材料去除率(MRR)随着C KDP的增加,证明了受控潮解机理的实用性。结果,避免了KDP表面上的腐蚀凹坑在某种程度上避免了。此外,随着抛光溶液的抛光溶液小于抛光溶液,KDP与KDP AQ / O微乳液(C KDP从10mM变为100mm)的粗糙度较小。在30mmol / L KDP AQ溶液中获得1.5nm的最小表面根平均方形粗糙度,因为最合适的潮疗法和MRR。

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