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Influence of the Workpiece Crystallographic Orientation on Ultra-Precision Turning of KDP Crystals

机译:工件晶体取向对KDP晶体超精密车削的影响

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The mechanical properties of Potassium Dihydrogen Phosphate (KDP) crystal had been relatively well investigated, and it was reported that mechanical properties of KDP crystal are anisotropic corresponding to crystallography orientation. However, the affect of the crystallography orientation to the critical undeformed chip thickness and cutting force variation in ductile mode cutting of KDP crystal are still not clear, which are important in determining proper cutting parameters to get fine finished surface. This paper investigates the influence of crystallographic orientation to critical undeformed chip thickness by a kind of groove cutting on {001} plane, and the influence to cutting force is also researched by face turning. The experiment results demonstrate that the cutting forces and critical undeformed chip thickness for ductile mode cutting varies greatly according to KDP crystallographic orientation. This paper point out that two slipping plane, {110} and {110}, account for the variation of cutting force and critical undeformed chip thickness in different orientation on {001} plane. A set of cutting parameters for ductile mode cutting are selected based on the derived critical undeformed chip thicknesses at different crystal orientations, and overall sooth surface has been achieved on face turned {001} surface, which the roughness is Ra 2.6nm measured by Veeco white-light interferometer.
机译:磷酸二氢钾(KDP)晶体的力学性能已得到比较充分的研究,据报道,KDP晶体的力学性能是各向异性的,与晶体学取向相对应。然而,在KDP晶体的延性模式切割中,晶体学取向对未变形的临界切屑厚度和切削力变化的影响仍然不清楚,这对于确定合适的切削参数以获得良好的精加工表面非常重要。本文研究了{001}面上的一种坡口切削对晶体取向对临界未变形切屑厚度的影响,并通过端面车削研究了切削力对切削力的影响。实验结果表明,延性模式切削的切削力和临界未变形切屑厚度根据KDP晶体学取向而变化很大。本文指出,{110}和{110}这两个打滑平面解释了切削力和{001}平面上不同方向的临界未变形切屑厚度的变化。基于在不同的晶体方向上导出的临界未变形切屑厚度,选择了一组用于延展模式切削的切削参数,并且在面翻过的{001}表面上获得了总体光滑表面,其粗糙度为Ra 2.6nm(通过Veeco white测量)光干涉仪。

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