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机译:工件晶体取向对KDP晶体超精密车削的影响
Department of Mechantronical Engineering and Automation,National University of Defense Technology, China Department of Mechanical Engineering, National University of Singapore, Singapore;
rnDalian University of Technology;
rnDepartment of Mechanical Engineering, National University of Singapore, Singapore;
KDP crystal; ductile mode cutting; critical undeformed chip thickness; groove cutting;
机译:超精密飞切割加工KDP晶体工件表面的形态学分析
机译:晶体学取向对KDP晶体球墨铸铁切削力和表面光洁度的影响
机译:晶体学取向对KDP晶体球墨铸铁切削力和表面光洁度的影响
机译:纳米晶测试中晶体学取向对(001)平面KDP晶体材料去除行为的影响
机译:晶体学取向对单晶超精密金刚石车削中材料行为的影响。
机译:超精密飞切削加工的KDP晶体工件表面的形貌分析
机译:晶体取向在各种各向异性材料(如单晶硅)超精密磨削中产生的力的作用