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首页> 外文期刊>Advances in Materials Physics and Chemistry >Investigation of Nickel Phthalocyanine Thin Films for Solar Cell Applications
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Investigation of Nickel Phthalocyanine Thin Films for Solar Cell Applications

机译:太阳能电池应用镍酞菁薄膜研究

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Ni-Phthalocyanine thin films were thermally evaporated with different substrate temperatures (300 - 450) K on (silicon wafer, glass) substrates. The chemical bonds of NiPc powder were investigated by FTIR spectrum, which introduce good information for NiPc bonds and their locations. The optical properties have been studied by UV-Visible, and Photoluminescence (PL) Spectra. The NiPc thin films have direct gap for all samples. The values of energy gap which is calculated by PL spectra are lower than those calculated by Tauc equation. It is found there are three activation energies, the mobility and concentration of carriers have been measured and, the NiPc films are p-type. P-NiPc/n-Si HJ solar cell was fabricated at substrates temperatures (300, 400) K. From I-V and C-V characteristic, abrupt junction has been found, photovoltaic characteristics have been observed with Voc of (0.335 - 0.415) V, and Isc of (2.77 - 4.26) A, and the efficiency of (3.08 - 5.03)% at room temperature and substrate temperature (300, 400 K) and under illumination of 55 mW/cm~2 using Halogen lamp. Ideality factors of the junction increase from (0.61 - 0.73) and barrier height increases from 2.53 eV to 3.69 eV while shunt resistance decreases from 3.76 K to 2.59 K and series resistance decreases slightly from 0.24 K to 0.23 K. The fill factor decreases from 0.46 to 0.4 with the increase of substrate temperature.
机译:用不同的基板温度(300-450)k上(硅晶片,玻璃)基板进行热蒸发Ni-酞菁薄膜。通过FTIR光谱研究了NIPC粉末的化学键,其引入了NIPC键及其位置的良好信息。已经通过UV可见光和光致发光(PL)光谱研究了光学性质。 NIPC薄膜对所有样品具有直接间隙。通过PL光谱计算的能量间隙值低于通过TaUC方程计算的值。发现有三个激活能量,迁移率和载体的浓度已经测量,NIPC膜是p型。在底物温度(300,400)K中制造了P-NIPC / N-Si HJ太阳能电池。来自IV和CV特性,已经发现了突变结,已经观察到光伏特性(0.335-0.415)V, ISC(2.77-4.26)A,室温下(3.08 - 5.03)%的效率(3.08-5.03)%(300,400 k),使用卤素灯照明55mW / cm〜2。从(0.61 - 0.73)和屏障高度增加的接合量增加的理想因素从2.53eV增加到3.69eV,而分流电阻从3.76 k降低到2.59 k,串联电阻略微从0.24 k降至0.23k。填充因子从0.46减少随着衬底温度的增加至0.4。

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