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首页> 外文期刊>Scientific reports. >Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface
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Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface

机译:GaN上的超薄硅氧氮化物层,无悬空 - 无粘合的GaN /绝缘界面

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摘要

Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO2 would be a key to synthesize a dangling-bond-free GaN/SiO2 interface. Here, we predict that a silicon oxynitride (Si4O5N3) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our ab initio calculations show that the GaN/Si4O5N3 structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si4O5N3 structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si4O5N3 structure.
机译:尽管去除界面的科技重要性悬挂债券,但甚至没有知道GaN和绝缘体之间的无悬空 - 粘合界面的理想模型。在结晶GaN和无定形SiO 2之间形成原子上薄的有序缓冲层将是合成无悬空粘合的GaN / SiO2界面的键。这里,我们预测氧氮化硅(Si4O5N3)层可以外延地在GaN(0001)表面上生长而不在界面处产生悬挂键。我们的AB Initio计算表明,GaN / Si4O5N3结构比氧化硅封端的GaN(0001)表面更稳定。通过修改界面附近的化学成分,可以调整GaN / Si4O5N3结构的电子特性。我们还提出了一种可能的方法来实验地合成GaN / Si4O5N3结构。

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