APS -APS March Meeting 2017 - Event - Design and Implementation of Multi-Qubit 3D Quantum Integrated Circuits

摘要

We present a superconducting integrated quantum circuit architecture that enables the high-fidelity measurement and control of multi-qubit devices. Superconducting through-silicon vias and 3D isolation caps allow for scalable circuits without tradeoffs in signal integrity, forming a platform for the implementation of a wide range of on-chip functionality. When combined with efficient, robust signal delivery and instrumentation, this approach can be scaled for sophisticated quantum information applications.