Soldering defect inspection system using image processing.

摘要

ABSTRACT Soldering is one of the metal joining process has great impact in manufacturing the electrical and electronic components. Identifying the solder joint defects is one of the tedious processes in order to minimize the production cost, to improve the quality of the metal joint and also to enhance the strength of the material. Defect identification methods are very challenging in all engineering industry. Without machining, the major defects can be identified by visual inspection method bu.