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Analysis of Kirk effect of an innovated high side Side-Isolated N-LDMOS device

机译:创新的高侧侧隔离N-LDMOS器件的柯克效应分析

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An ESOA of LDMOS device is very critical for power device performance. Kirk effect is the one of the major problem which leads to poor ESOA performance. The cause of the problem mainly due to the high beta value of parasitic NPN transistor in the p-body. In this study, we proposed a new 3D high side Side–Isolated N-Channel LDMOS which we have obtained not only benchmark Ron and breakdown performance, but also better ESOA without Kirk effect. We have compared the analysis of Kirk effect between the new device and the conventional N–LDMOS structure with LATID technique for the formation of the p–body of both device structures.
机译:LDMOS器件的ESOA对于功率器件的性能至关重要。柯克效应是导致ESOA性能不佳的主要问题之一。问题的原因主要是由于p体内寄生NPN晶体管的beta值较高。在这项研究中,我们提出了一种新的3D高端侧隔离N沟道LDMOS,不仅获得了基准Ron和击穿性能,而且还获得了更好的ESOA,且没有柯克效应。我们比较了使用LATID技术对新器件与常规N-LDMOS结构之间的Kirk效应进行分析,以形成两种器件结构的p型体。

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