首页> 外文期刊>Journal of Laser Micro/Nanoengineering >Towards Optimized Efficiency of Ablation in Copper using a 515nm Picosecond Laser Process
【24h】

Towards Optimized Efficiency of Ablation in Copper using a 515nm Picosecond Laser Process

机译:使用515nm皮秒激光工艺实现铜的最佳烧蚀效率

获取原文
           

摘要

A shorter laser pulse provides smaller heat affected zones and higher ablation accuracy, which are demanded for metal micro-fabrication processes. In particular, picosecond laser systems, which are suitable for operation in industrial environments, are of great interest for many practical applica-tions. However, low productivity has been a limitation to broadening their industrial application. It was recently reported that when micromachining copper with a 1064 nm picosecond laser, a desira-ble pulse energy and repetition rate exist for achieving the maximum volume ablation rate. In this paper, we used a 515 nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, and determined its optimum pulse energy and repetition rate. A theoretical analysis based on the experimental data on copper ablation showed that using a 515 nm picosecond laser instead of a 1064 nm picosecond laser is favorable in that the calculated threshold fluence is 75 % lower and the optical penetration depth is 50 % greater.
机译:较短的激光脉冲可提供较小的热影响区和较高的烧蚀精度,这是金属微加工工艺所需的。尤其是,适合在工业环境中运行的皮秒激光系统对许多实际应用非常感兴趣。然而,低生产率一直是扩展其工业应用的限制。最近报道,当用1064nm皮秒激光对铜进行微加工时,为了获得最大的体积烧蚀率,存在令人希望的脉冲能量和重复率。在本文中,我们使用了515 nm皮秒激光,该激光在吸收激光能量方面对铜的微加工效率更高,并确定了其最佳脉冲能量和重复频率。基于有关铜烧蚀的实验数据的理论分析表明,使用515 nm皮秒激光代替1064 nm皮秒激光是有利的,因为计算出的阈值通量要低75%,光穿透深度要高50%。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号