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(Invited Paper) Laser-Induced Forward Transfer of Functional Materials: Advances and Future Directions

机译:(特邀论文)激光诱导功能材料的正向转移:进展和未来方向

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Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of func-tional materials offer unique advantages and capabilities for the rapid prototyping of electronic, op-tical and sensor elements as opposed to other digital printing processes like inkjet. LIFT processes have been applied to the fabrication of a wide variety of microelectronic elements such as intercon-nects, passive components, antennas, sensors, power sources and embedded circuits. Overall, LDW techniques are highly adaptable digital microfabrication processes in terms of materials versatility, substrate compatibility and range of writing speed, scale and resolution. This article will describe the unique advantages and capabilities of LIFT-based processes when used in conjunction with flu-ids and nanopastes, discuss their applications and consider their future for printing electronics.
机译:与功能性材料的其他数字印刷工艺相比,基于功能材料的激光感应正向传输(LIFT)的激光直写(LDW)技术为电子,光学和传感器元件的快速原型制作提供了独特的优势和功能。 。 LIFT工艺已应用于多种微电子元件的制造,例如互连,无源元件,天线,传感器,电源和嵌入式电路。总体而言,就材料的多功能性,基板的兼容性以及写入速度,规模和分辨率的范围而言,LDW技术是高度适应性的数字微加工工艺。本文将描述基于LIFT的工艺与流体和纳米浆料结合使用时的独特优势和功能,讨论其应用并考虑其在印刷电子领域的未来。

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