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Through Hole Forming Method Using a Flowable Backing Material During Pulse UV Laser Radiation

机译:在脉冲紫外激光辐射过程中使用可流动的背衬材料的通孔成型方法

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This paper presents a unique through hole forming method using a flowable backing material during pulse UV laser radiation. During the laser radiation, the backing material such as polymer material solution is arranged to be in contact with the back side of a target material (workpiece), i.e., surface of laser beam’s exit side. This unique through hole forming method can easily control the shape of a through hole, e.g., formation of a through hole having straight shape in which the exit hole diameter on the laser beam exit side of the processing target is equal to the entrance hole diameter on the laser beam incident side, or formation of a through hole having so-called inverse tapered shape where the diameter of a formed through hole on the laser beam exit side is larger than the incident side.
机译:本文提出了一种独特的通孔形成方法,该方法在脉冲UV激光辐射过程中使用可流动的背衬材料。在激光辐射期间,将诸如聚合物材料溶液之类的背衬材料布置成与目标材料(工件)的背侧,即激光束出射面的表面接触。这种独特的通孔形成方法可以容易地控制通孔的形状,例如,形成具有笔直形状的通孔,其中加工目标的激光束出射侧上的出射孔直径等于加工目标上的出射孔直径。激光束入射侧,或形成具有所谓的倒锥形的通孔,其中在激光束出射侧上形成的通孔的直径大于入射侧。

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