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首页> 外文期刊>Journal of Industrial Engineering and Management >An integrated model for process parameter adjustment to recover throughput shortage in semiconductor assembly: A case study
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An integrated model for process parameter adjustment to recover throughput shortage in semiconductor assembly: A case study

机译:一个过程参数调整的集成模型,以恢复半导体组件中的产能短缺:一个案例研究

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Purpose: Existing productivity improvements activities such as inventory buffer, overall equipment effectiveness (OEE) and total productive maintenance (TPM) do not analytically associate the throughput shortage with process parameters. The paper aims to develop and test an integrated model to recover the throughput shortage through process parameters adjustment in a semiconductor assembly. Design/methodology/approach: The mathematical model of planned throughput is developed as a function of input parameters in an integrated multiple process line. When the planned throughput does not meet the real-time throughput, the throughput shortage occurs. The planned throughput for the next day is summed with the throughput shortage from previous day and mathematical programming is used to find the optimum process parameter values. Findings: The throughput shortage is restored using mathematical programming for the subsequent day of planning. If there still exist throughput shortage, the additional throughput shortage will be carried forward for the subsequent day of planning where mathematical programming is used again to find the adjusted process parameters. The proposed optimization model in essentially a parametric model using input parameters of real-time data based on a normal distribution that is translated into a range of minimum and maximum using 95% confidence interval. Research limitations/implications: The adjusted input parameters in this model is based on the cycle time of three processes which are Die Attach, Wire Bond and Pre-Cap Inspection. Downtime and setup time are not subjected to adjustments. Practical implications: The mathematical programming computes optimum process parameters values to restore the throughput shortage where it correlates the process parameters and throughput shortage quantitatively rather than conventional method of throughput shortage recovery. Originality/value: The research addresses the process parameter adjustment to recover the throughput shortage in integrated multiple processes.
机译:目的:现有的生产力改善活动,例如库存缓冲,总体设备效率(OEE)和总生产维护(TPM),不会将吞吐量不足与过程参数关联起来。本文旨在开发和测试集成模型,以通过调整半导体组件中的工艺参数来弥补吞吐量不足。设计/方法/方法:计划生产量的数学模型是根据集成多流程生产线中输入参数的函数而开发的。当计划的吞吐量不满足实时吞吐量时,将发生吞吐量不足。第二天的计划生产量与前一天的生产量短缺相加,并使用数学编程来找到最佳过程参数值。调查结果:在计划的第二天,使用数学编程来解决吞吐量不足的问题。如果仍然存在吞吐量不足,则额外的吞吐量不足将被结转到计划的第二天,在该天中再次使用数学编程来查找调整后的过程参数。所建议的优化模型基本上是一个参数模型,该模型使用基于正态分布的实时数据输入参数,并使用95%置信区间将其转化为最小和最大范围。研究的局限性/意义:该模型中调整后的输入参数基于三个过程的循环时间,即芯片附着,引线键合和盖前检查。停机时间和设置时间不受调整。实际意义:数学编程可计算最佳过程参数值,以恢复吞吐量不足,从而定量地关联过程参数和吞吐量不足,而不是传统的吞吐量不足恢复方法。独创性/价值:该研究解决了过程参数调整问题,以弥补集成多个过程中的吞吐量不足。

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